The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Nov. 28, 2000
Harry Kam Cheng Hong, Melaka, MY;
Hu Ah Lek, Melaka, MY;
Santhiran Nadarajah, Melaka, MY;
Sharon Ko Mei Wan, Melaka, MY;
Chan Peng Yeen, Melaka, MY;
Jaime Bayan, Palo Alto, CA (US);
Peter Howard Spalding, Cupertino, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A leadless leadframe semiconductor package comprising a plurality of contacts, which have contact surfaces on the bottom surface of the package. At least some of the contacts have integrally formed stems that extend outward to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates at least a portion of the die, the stems and the contacts. The molded cap leaves the contact surfaces of the contacts exposed on the bottom surface of the package, leaves a peripheral surface of the stems exposed on the peripheral surface of the package, and covers a bottom surface of each of the stems. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, each array of device areas having a plurality of tie bars and a plurality of contacts. The contacts have contact surfaces on the bottom surface of the leadless leadframe panel assembly. The contacts also have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts. A molded cap encapsulates at least a portion of each die, the tie bars, the stems and the contacts while leaving the contact surfaces of the contacts exposed and covering a bottom surface of each of the stems.