Harry Kam Cheng Hong

Title: Innovations by Harry Kam Cheng Hong

Introduction

Harry Kam Cheng Hong is a notable inventor based in Malacca, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 8 patents. His work focuses on enhancing the structural integrity and functionality of semiconductor devices.

Latest Patents

One of his latest patents involves the "Locking of mold compound to conductive substrate panels." This invention describes a panel assembly for packaged integrated circuit devices that includes a conductive substrate panel with an array of device areas and multiple locking passageways. These passageways are strategically positioned around an inactive buffer area that surrounds the periphery of the device areas. The assembly also features a molded cap that encapsulates the array of device areas and the inactive buffer area, ensuring that the molded cap remains securely attached during the singulation process.

Another significant patent by Harry is related to a "Leadless leadframe package design that provides greater structural integrity." This design includes a leadless leadframe semiconductor package with contacts that have surfaces on the bottom of the package. Some contacts feature integrally formed stems that extend outward, providing enhanced structural support. The molded cap in this design encapsulates portions of the die, stems, and contacts, contributing to the overall integrity of the package.

Career Highlights

Harry Kam Cheng Hong has made a remarkable impact at National Semiconductor Corporation, where he has been instrumental in developing innovative semiconductor packaging solutions. His expertise in this field has led to advancements that improve the performance and reliability of electronic devices.

Collaborations

Throughout his career, Harry has collaborated with talented individuals such as Sharon Ko Mei Wan and Santhiran Nadarajah. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Harry Kam Cheng Hong's contributions to semiconductor packaging through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the design and functionality of electronic devices, showcasing the importance of innovation in technology.