The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Aug. 11, 2003
Harry Kam Cheng Hong, Melaka, MY;
Hu Ah Lek, Melaka, MY;
Santhiran Nadarajah, Melaka, MY;
Sharon Ko Mei Wan, Melaka, MY;
Chan Peng Yeen, Melaka, MY;
Jaime Bayan, Palo Alto, CA (US);
Peter Howard Spalding, Cupertino, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A leadless leadframe semiconductor package includes a plurality of contacts, at least some of which have integrally formed stems that extend to the peripheral surface of the package. These stems have heights and widths less than the heights and widths of their corresponding contacts. A molded cap encapsulates the stems and the contacts to leave contact surfaces of the contacts exposed on the bottom surface of the package. Another aspect of the invention pertains to a leadless leadframe panel assembly having a conductive substrate panel that has at least one array of device areas, which has a plurality of tie bars and a plurality of contacts. The contacts have integrally formed stems that extend towards and connect to one of the tie bars. The stems have widths and heights that are less than the widths and heights of their corresponding contacts.