The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2004
Filed:
Jul. 14, 2000
Jaime Bayan, Palo Alto, CA (US);
Peter H. Spalding, Cupertino, CA (US);
Harry Cheng-Hong Kam, Melaka, MY;
Ah Lek Hu, Bukit Baru, MY;
Sharon Mei Wan Ko, Melaka, MY;
Santhiran Nadarajah, Bachang, MY;
Aik Seng Kang, Melaka, MY;
Yin Yen Bong, Maleka, MY;
National Semiconductor, Santa Clara, CA (US);
Abstract
An assembly and method suitable for use in packaging integrated circuits including a support substrate for supporting an integrated circuit die embedded in a molded encapsulating cap. The substrate includes a conductive die attach pad adapted to be molded into the encapsulating cap. The pad includes an interior facing support surface and a spaced-apart exterior facing exposed surface defined by a peripheral edge. The support surface is adapted to support the embedded die, while the exposed surface is to be exposed from the encapsulating cap. The attach pad further includes a locking ledge portion extending outward peripherally beyond at least a portion of the exposed surface peripheral edge. This ledge is adapted to be subtended in the encapsulating cap in a manner substantially preventing a pull-out of the attach pad in a direction away from the encapsulating cap.