Company Filing History:
Years Active: 2002-2004
Title: Aik Seng Kang: Innovator in Integrated Circuit Packaging
Introduction
Aik Seng Kang is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His innovative designs and methods have advanced the technology used in electronic devices.
Latest Patents
Aik Seng Kang's latest patents include two remarkable inventions. The first is a "Locking lead tips and die attach pad for a leadless package apparatus and method." This invention involves an assembly and method suitable for packaging integrated circuits. It features a support substrate that supports an integrated circuit die embedded in a molded encapsulating cap. The conductive die attach pad is designed to be molded into the encapsulating cap, providing a secure support surface for the embedded die. The pad's locking ledge portion prevents pull-out, ensuring reliability in electronic applications.
The second patent is a "Rotary mechanical buffing method for deflashing of molded integrated circuit packages." This system utilizes a rotary buffing device to remove mold-flash from leadless leadframe substrate panels. The device operates at a high rotation rate, effectively brushing off thin layers of molding material from the electrical contact landings and die attach pads. This innovation enhances the manufacturing process of integrated circuits by improving the quality of the final product.
Career Highlights
Aik Seng Kang is currently employed at National Semiconductor Corporation, where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in improving the efficiency and effectiveness of integrated circuit packaging.
Collaborations
Throughout his career, Aik has collaborated with talented individuals such as Ah Lek Hu and Jaime A Bayan. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Aik Seng Kang is a distinguished inventor whose contributions to integrated circuit packaging have made a lasting impact on the industry. His patents reflect his commitment to advancing technology and improving manufacturing processes. His work continues to inspire future innovations in the field.