Location History:
- Bukit Baru, MY (2004)
- Melaka, MY (2002 - 2007)
Company Filing History:
Years Active: 2002-2007
Title: The Innovative Contributions of Ah Lek Hu
Introduction
Ah Lek Hu is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work primarily focuses on enhancing the reliability and efficiency of lead frame packaging techniques.
Latest Patents
Among his latest patents is the "Universal Clamping Mechanism," which outlines a method for processing lead frames. This invention involves placing a lead frame base tape on a porous block and utilizing a vacuum system to facilitate the processing. Additionally, he has developed methods for "Enhanced Solder Joint Strength and Ease of Inspection of Leadless Leadframe Package (LLP)." This patent describes a fabrication process that improves solder joint reliability by incorporating undercut regions in the contacts, allowing for better adhesion and visual inspection of solder joints.
Career Highlights
Ah Lek Hu is currently employed at National Semiconductor Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing lead frame packaging techniques, which are crucial for the reliability of electronic devices.
Collaborations
He has collaborated with talented coworkers, including Jaime A Bayan and Sharon Mei Wan Ko, who contribute to the innovative environment at National Semiconductor Corporation.
Conclusion
Ah Lek Hu's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence the development of reliable electronic packaging solutions.