The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2005
Filed:
Dec. 10, 2002
Felix C. LI, San Jose, CA (US);
Jaime A. Bayan, Palo Alto, CA (US);
Santhiran Nadarajah, Melaka, MY;
Ah Lek HU, Melaka, MY;
Felix C. Li, San Jose, CA (US);
Jaime A. Bayan, Palo Alto, CA (US);
Santhiran Nadarajah, Melaka, MY;
Ah Lek Hu, Melaka, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
Methods of fabricating leadless packages are described that provide good solder joint reliability. In most respects, the packages are fabricated in a manner similar to current lead frame based leadless packaging techniques. However, at some point in the process, the contacts are provided with undercut regions that are left exposed during solder plating so that the solder plating also covers the exposed side and undercut segments of the contacts. When the resultant devices are soldered to an appropriate substrate (after singulation), each resulting solder joint includes a fillet that adheres very well to the undercut portion of contact. This provides a high quality solder joint that can be visually inspected from the side of the package.