The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2002

Filed:

Nov. 15, 2000
Applicant:
Inventors:

Ah Lek Hu, Melaka, MY;

Sharon Mei Wan Ko, Melaka, MY;

Peng Yeen Chan, Melaka, MY;

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 1/702 ;
U.S. Cl.
CPC ...
F25D 1/702 ;
Abstract

A cooling system to reduce damage resulting from panel singulation is provided. A panel may be formed by encapsulating a lead frame with mounted dice. The encapsulating material may be a composite, plastic, or ceramic. Singulation may be a cutting done by laser, water jet, or saw. A chiller system cools a fluid, such as water, to a temperature below 16° C. The cooled fluid is dispensed to a part of the panel being singulated. For example, if a circular saw is used to cut the panel, a plurality of nozzles may be used to direct the fluid to the part of the saw cutting the panel, which defines the part of the panel being singulated. The cooled fluid, cools the panel preventing burring, smearing, and melting of metal contacts.


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