Poughkeepsie, NY, United States of America

Paul A Totta

This inventor holds 20 USPTO granted patents, plus 1 CIPO patent, primarily in Semiconductor Packaging. Top assignee: International Business Machines Corporation. Active years: 1977-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul A Totta. Retrieved from https://idiyas.com/inventor/paul-a-totta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 3.6

ph-index = 13

Forward Citations = 566(Granted Patents)


Company Filing History:


Years Active: 1977-2001

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Areas of Expertise:
Wafer-Level Testing
Interconnect Structure
Aluminum-Copper
Thin Film Modification
Electroplated Solder
Solder Interconnections
Multilayered Intermetallic
Contact Stud Structure
Conduction-Cooled Package
Vacuum Deposition
Hybrid Metallurgies
Chip Contacts
20 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Paul A. Totta

Introduction

Paul A. Totta is a distinguished inventor located in Poughkeepsie, NY. He has been granted a remarkable total of 20 patents throughout his career, highlighting his significant contributions to the field of electronics and integrated circuits. His innovative approaches have paved the way for advancements in electronic testing and interconnect structures.

Latest Patents

Among his latest innovations, Paul has developed a patent for selective wafer-level testing and burn-in. This invention allows for selective electrical connections between an electronic component and a test substrate using a dissolvable electrical conductive material. This unique feature enables rework and repair of a wafer at the wafer level, as well as retesting at the wafer level. Furthermore, this conductive material can be incorporated into a permanent package, ensuring complete electrical conductivity and reliable connection between the electronic component and the substrate.

Another notable patent by Paul is for an interconnect structure using Al₂Cu for integrated circuit chips. This invention addresses the challenge of electromigration at high current densities by incorporating patterned interconnect layers of Al or Al-Cu and interlayer contact regions or studs of Al₂Cu. This innovative approach provides a continuous path for Cu and/or Al atoms to move within the interconnect structure, thereby improving reliability and performance.

Career Highlights

Paul A. Totta has made significant contributions during his tenure at the International Business Machines Corporation (IBM), a globally recognized leader in technology and innovation. His work in the field of electronics has garnered him a reputation as a key innovator and problem-solver.

Collaborations

During his career, Paul has collaborated with talented colleagues including James F. White and Kenneth Parker Rodbell. These collaborations have fostered a rich environment for creativity and the exchange of ideas, further enhancing the impact of his inventions on the industry.

Conclusion

Paul A. Totta's innovative spirit and dedication to advancing technology have led to numerous patents that significantly contribute to the fields of electronics and integrated circuits. His work at IBM, along with his collaborations, showcases his commitment to driving progress and innovation in an ever-evolving industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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