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For the Inventor, By the Inventor

Poughkeepsie, NY, United States of America

Paul A Totta

USPTO Granted Patents = 20

Average Co-Inventor Count = 3.6

ph-index = 13

Forward Citations = 563(Granted Patents)


Company Filing History:

goldMedal20 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1977-2001

where 'Filed Patents' based on already Granted Patents

20 patents (USPTO):
1. 6255208 - Selective wafer-level testing and burn-in (2001-07-03),
2. 6110819 - Interconnect structure using Al.sub.2 Cu for an integrated circuit chip (2000-08-29),
3. 6068923 - Use of argon sputtering to modify surface properties by thin film (2000-05-30),
4. 5956573 - Use of argon sputtering to modify surface properties by thin film (1999-09-21),
5. 5925933 - Interconnect structure using Al.sub.2 -Cu for an integrated circuit chip (1999-07-20),
6. 5629564 - Electroplated solder terminal (1997-05-13),
7. 5565707 - Interconnect structure using a Al.sub.2 Cu for an integrated circuit chip (1996-10-15),
8. 5503286 - Electroplated solder terminal (1996-04-02),
9. 5251806 - Method of forming dual height solder interconnections (1993-10-12),
10. 5171642 - Multilayered intermetallic connection for semiconductor devices (1992-12-15),
11. 5130779 - Solder mass having conductive encapsulating arrangement (1992-07-14),
12. 5071714 - Multilayered intermetallic connection for semiconductor devices (1991-12-10),
13. 5008730 - Contact stud structure for semiconductor devices (1991-04-16),
14. 5008216 - Process for improved contact stud structure for semiconductor devices (1991-04-16),
15. 4839715 - Chip contacts without oxide discontinuities (1989-06-13),

Title: Innovations and Contributions of Paul A. Totta

Introduction

Paul A. Totta is a distinguished inventor located in Poughkeepsie, NY. He has been granted a remarkable total of 20 patents throughout his career, highlighting his significant contributions to the field of electronics and integrated circuits. His innovative approaches have paved the way for advancements in electronic testing and interconnect structures.

Latest Patents

Among his latest innovations, Paul has developed a patent for selective wafer-level testing and burn-in. This invention allows for selective electrical connections between an electronic component and a test substrate using a dissolvable electrical conductive material. This unique feature enables rework and repair of a wafer at the wafer level, as well as retesting at the wafer level. Furthermore, this conductive material can be incorporated into a permanent package, ensuring complete electrical conductivity and reliable connection between the electronic component and the substrate.

Another notable patent by Paul is for an interconnect structure using Al₂Cu for integrated circuit chips. This invention addresses the challenge of electromigration at high current densities by incorporating patterned interconnect layers of Al or Al-Cu and interlayer contact regions or studs of Al₂Cu. This innovative approach provides a continuous path for Cu and/or Al atoms to move within the interconnect structure, thereby improving reliability and performance.

Career Highlights

Paul A. Totta has made significant contributions during his tenure at the International Business Machines Corporation (IBM), a globally recognized leader in technology and innovation. His work in the field of electronics has garnered him a reputation as a key innovator and problem-solver.

Collaborations

During his career, Paul has collaborated with talented colleagues including James F. White and Kenneth Parker Rodbell. These collaborations have fostered a rich environment for creativity and the exchange of ideas, further enhancing the impact of his inventions on the industry.

Conclusion

Paul A. Totta's innovative spirit and dedication to advancing technology have led to numerous patents that significantly contribute to the fields of electronics and integrated circuits. His work at IBM, along with his collaborations, showcases his commitment to driving progress and innovation in an ever-evolving industry.

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