The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 1992
Filed:
Jan. 08, 1991
Applicant:
Inventors:
Patrick W DeHaven, Poughkeepsie, NY (US);
J Daniel Mis, Poughkeepsie, NY (US);
Kenneth P Rodbell, Poughkeepsie, NY (US);
Paul A Totta, Poughkeepsie, NY (US);
James F White, Newburgh, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; C23C / ; C23C / ;
U.S. Cl.
CPC ...
428620 ; 428651 ; 20419217 ; 427123 ; 257750 ;
Abstract
A low copper concentration multilayered, device interconnect metallurgy, comprises an aluminum-copper (<2 weight percent copper) conductor having formed on one of its surfaces a layer of an intermetallic compound formed from a Group IVA metal and aluminum from the aluminum-copper conductor. The intermetallic compound is formed so as to contain only the single phase line compound of the intermetallic compound.