Poughkeepsie, NY, United States of America

Patrick William Dehaven

This inventor holds 21 USPTO granted patents, primarily in Interconnect Technology. Top assignees: International Business Machines Corporation, Infineon Technologies Ag. Active years: 1992-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Patrick William Dehaven. Retrieved from https://idiyas.com/inventor/patrick-william-dehaven

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 21

% Patents Active = 57.1

Average Co-Inventor Count = 5.0

ph-index = 9

Forward Citations = 254(Granted Patents)

Location History:

Hopewell Junction, NY (US) (2011)
Poughkeepsie, NY (US) (1992 - 2015)

Company Filing History:

21 out of 166,409

International Business Machines Corporation

patents

1 out of 15,036

Infineon Technologies Ag

patents

where one patent can have more than one assignee

Years Active: 1992-2015

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Areas of Expertise:

Capacitance Tuning

Copper Interconnect

Low Resistance Contact

Electromigration

Thin Film Barrier

Grain Growth Control

Salicide Formation

Metallization Structure

Hybrid Processing

Intermetallic Connection

Electrical Interconnections

Microstructure

21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9224675 - Automatic capacitance tuning for robust middle of the line contact and silicide applications (2015-12-29),

2. 8574953 - Low temperature melt-processing of organic-inorganic hybrid (2013-11-05),

3. 8123997 - Low temperature melt-processing of organic-inorganic hybrid (2012-02-28),

4. 7951708 - Copper interconnect structure with amorphous tantalum iridium diffusion barrier (2011-05-31),

5. 7456045 - Low temperature melt-processing of organic-inorganic hybrid (2008-11-25),

6. 7407875 - Low resistance contact structure and fabrication thereof (2008-08-05),

7. 7291516 - Low temperature melt-processing of organic-inorganic hybrid (2007-11-06),

8. 7223691 - Method of forming low resistance and reliable via in inter-level dielectric interconnect (2007-05-29),

9. 6916729 - Salicide formation method (2005-07-12),

10. 6638374 - Device produced by a process of controlling grain growth in metal films (2003-10-28),

11. 6572982 - Electromigration-resistant copper microstructure (2003-06-03),

12. 6509265 - Process for manufacturing a contact barrier (2003-01-21),

13. 6437440 - Thin film metal barrier for electrical interconnections (2002-08-20),

14. 6361627 - Process of controlling grain growth in metal films (2002-03-26),

15. 6333120 - Method for controlling the texture and microstructure of plated copper and plated structure (2001-12-25),

Title: Exploring the Innovative Mind of Patrick William Dehaven

Introduction: Patrick William Dehaven, a prolific inventor hailing from Poughkeepsie, NY, has made significant strides in the field of technology with an impressive portfolio of 24 patents to his name.

Latest Patents: Among his recent patents, one noteworthy invention is "Automatic Capacitance Tuning for Robust Middle of the Line Contact and Silicide Applications." This method involves intricate processes like forming metal liners and creating a middle-of-the-line contact, showcasing Dehaven's expertise in advanced materials and semiconductor technologies. Another patent, "Low Temperature Melt-Processing of Organic-Inorganic Hybrid," demonstrates his innovative approach to material science and processing techniques.

Career Highlights: Dehaven's career has been marked by his contributions to renowned companies such as IBM (International Business Machines Corporation) and Hypernex, Inc. His pioneering work in these organizations has not only led to the development of groundbreaking technologies but has also solidified his reputation as a visionary in the industry.

Collaborations: Throughout his career, Dehaven has collaborated with talented individuals like Cyprian Emeka Uzoh and Kenneth Parker Rodbell. These collaborations have been instrumental in bringing forth new ideas and pushing the boundaries of technological innovation.

Conclusion: Patrick William Dehaven's exceptional talent and dedication to innovation have positioned him as a leading figure in the world of technology. With a remarkable track record of patents and a history of successful collaborations, Dehaven continues to inspire the next generation of inventors and researchers in the ever-evolving landscape of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]