The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Jan. 25, 1999
William Emmett Bernier, Endwell, NY (US);
Claude Louis Bertin, South Burlington, VT (US);
Anilkumar Chinuprasad Bhatt, Johnson City, NY (US);
Michael Anthony Gaynes, Vestal, NY (US);
Erik Leigh Hedberg, Essex Junction, VT (US);
Nikhil M. Murdeshwar, Abington, PA (US);
Mark Vincent Pierson, Binghamton, NY (US);
William R. Tonti, Essex Junction, VT (US);
Paul A. Totta, Poughkeepsie, NY (US);
Joseph John Van Horn, Underhill, VT (US);
Jerzy Maria Zalesinski, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting at the wafer-level. In addition, the conductive material may also be used in a permanent package, since the conductive material of the present invention provides complete electrical conductivity and connection between the electronic component and the substrate.