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For the Inventor, By the Inventor

Essex Junction, VT, United States of America

Jerzy Maria Zalesinski

USPTO Granted Patents = 35

Average Co-Inventor Count = 4.5

ph-index = 20

Forward Citations = 1,743(Granted Patents)


Location History:

  • Endicott, NY (US) (1991)
  • Essex Jet, VT (US) (1995 - 1996)
  • Crittenden County, VT (US) (1996 - 1998)
  • Essex Junction, NY (US) (2002)
  • Essex Junction, VT (US) (1996 - 2008)

Company Filing History:

goldMedal35 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1991-2008

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35 patents (USPTO):
1. 7394268 - Carrier for test, burn-in, and first level packaging (2008-07-01),
2. 7196908 - Dual pitch contact pad footprint for flip-chip chips and modules (2007-03-27),
3. 7132841 - Carrier for test, burn-in, and first level packaging (2006-11-07),
4. 6943452 - Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality (2005-09-13),
5. 6816374 - High efficiency heat sink/air cooler system for heat-generating components (2004-11-09),
6. 6793500 - Radial contact pad footprint and wiring for electrical components (2004-09-21),
7. 6541837 - Charge-coupled device wafer cover plate with compact interconnect wiring (2003-04-01),
8. 6410431 - Through-chip conductors for low inductance chip-to-chip integration and off-chip connections (2002-06-25),
9. 6388198 - Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality (2002-05-14),
10. 6358627 - Rolling ball connector (2002-03-19),
11. 6319745 - Formation of charge-coupled-device with image pick-up array (2001-11-20),
12. 6255208 - Selective wafer-level testing and burn-in (2001-07-03),
13. 6236115 - High density integrated circuit packaging with chip stacking and via interconnections (2001-05-22),
14. 6222276 - Through-chip conductors for low inductance chip-to-chip integration and off-chip connections (2001-04-24),
15. 6212076 - Enhanced heat-dissipating printed circuit board package (2001-04-03),

Title: Innovations by Jerzy Maria Zalesinski

Introduction

Jerzy Maria Zalesinski is a prominent inventor located in Essex Junction, Vermont. With an impressive portfolio of 35 patents, his work has significantly impacted the semiconductor packaging and testing industry. He is currently employed at the International Business Machines Corporation (IBM), where his innovative solutions continue to shape technology.

Latest Patents

Among his latest patents, Zalesinski has developed a "Carrier for test, burn-in, and first level packaging". This invention allows a plurality of semiconductor devices to be positioned on a carrier for testing or burn-in processes. The carrier can subsequently be cut into individual or multi-chip-on-carrier components, serving a dual purpose for testing and packaging. One notable feature includes a lead reduction mechanism, such as a built-in self-test engine, which enhances the efficiency of testing and burn-in steps. Additionally, another significant invention titled "Dual pitch contact pad footprint for flip-chip chips and modules" outlines an electronic device with a variety of contact pads arranged at different predetermined distances, facilitating advanced chip configurations.

Career Highlights

Zalesinski's career at IBM has been marked by his commitment to innovation in semiconductor technology. His contributions through numerous patents highlight his expertise in addressing complex challenges related to electronic devices and their components. His innovative approaches have positioned him as a key figure within the organization.

Collaborations

Throughout his career, Zalesinski has collaborated with esteemed colleagues including Michael A. Gaynes and William R. Tonti. These partnerships have enabled the sharing of ideas and advancements, leading to the successful development of groundbreaking technologies in the semiconductor industry.

Conclusion

Jerzy Maria Zalesinski’s contributions to the field of semiconductor technology through his patents indicate his exceptional talent and dedication as an inventor. His work continues to facilitate advancements in testing, burn-in, and packaging processes, ensuring that he remains at the forefront of innovation at IBM. As he progresses in his career, the impact of his inventions promises to influence the future of the industry profoundly.

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