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For the Inventor, By the Inventor

Annandale, NJ, United States of America

Osvaldo Jorge Lopez

This inventor holds 56 USPTO granted patents and 9 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging. Top assignees: Texas Instruments Corporation, Ciclon Semiconductor Device Corp., Other. Active years: 1985-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Osvaldo Jorge Lopez. Retrieved from https://idiyas.com/inventor/osvaldo-jorge-lopez

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 56 

% Patents Active = 98.2

 

Average Co-Inventor Count = 3.0

ph-index = 10

Forward Citations = 352(Granted Patents)

Forward Citations (Not Self Cited) = 323(Dec 10, 2025)


Location History:

  • Northbrook, IL (US) (1985)
  • Chicago, IL (US) (1986)
  • Lincoln, NE (US) (2003)
  • Annandale, NJ (US) (2007 - 2024)
  • Annadale, NJ (US) (2024)

Company Filing History:

goldMedal50 out of 29,888 
 
Texas Instruments Corporation
 patents
silverMedal3 out of 9 
 
Ciclon Semiconductor Device Corp.
 patents
bronzeMedal3 out of 834,513 
Other
 patents

Years Active: 1985-2026

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Areas of Expertise:
Flip-Chip Packaging
Power Converters
Multi-Die Packages
Silicon Packages
Solder Standoff
Thermal Management
Ultra-Thin Transistors
Conductive Plates
DC-DC Converters
Embedded Systems
High I/O Density
Photo-Sensitive Silicon
56 patents (USPTO):Explore Patents
1. 12575025 - Stress relief structure for flip-chip packaged devices (2026-03-10),
2. 12406915 - Plated metal layer in power packages (2025-09-02),
3. 12243809 - Packaged electronic device with film isolated power stack (2025-03-04),
4. 12176274 - Multi-die package with multiple heat channels (2024-12-24),
5. 11930590 - Stress relief for flip-chip packaged devices (2024-03-12),
6. 11908780 - Semiconductor package with solder standoff (2024-02-20),
7. 11817375 - High I/O density flip-chip QFN (2023-11-14),
8. 11784114 - Plated metal layer in power packages (2023-10-10),
9. 11658130 - Conductive plate stress reduction feature (2023-05-23),
10. 11640932 - Packaged electronic device with film isolated power stack (2023-05-02),
11. 11177246 - Photo-sensitive silicon package embedding self-powered electronic system (2021-11-16),
12. 11177197 - Semiconductor package with solder standoff (2021-11-16),
13. 11043477 - Power converter monolithically integrating transistors, carrier, and components (2021-06-22),
14. 11024564 - Packaged electronic device with film isolated power stack (2021-06-01),
15. 10930582 - Semiconductor device having terminals directly attachable to circuit board (2021-02-23),

Title: Inventor Osvaldo Jorge Lopez - Revolutionizing Technology

Introduction: Osvaldo Jorge Lopez is a visionary inventor based in Annandale, NJ (US) known for his groundbreaking contributions to the field of technology.

Latest Patents: Osvaldo Jorge Lopez holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovation.

Career Highlights: With a career spanning over two decades, Osvaldo Jorge Lopez has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout his career, Osvaldo Jorge Lopez has collaborated with top scientists, engineers, and researchers globally, fostering a culture of innovation and knowledge sharing that has led to numerous successful projects and inventions.

Conclusion: Osvaldo Jorge Lopez's passion for innovation and his relentless pursuit of excellence continue to drive him towards creating technologies that have the potential to shape the future of our world.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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