The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Nov. 26, 2018
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Jonathan Almeria Noquil, Plano, TX (US);
Osvaldo Jorge Lopez, Annandale, NJ (US);
Tianyi Luo, Richardson, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/3736 (2013.01); H01L 23/4093 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 25/0657 (2013.01);
Abstract
A semiconductor package comprises a first die thermally coupled to a first thermally conductive device. The first thermally conductive device has a first surface exposed to an exterior of the semiconductor package. The package comprises a second die thermally coupled to a second thermally conductive device, the second thermally conductive device having a second surface exposed to an exterior of the semiconductor package. The first and second dies are positioned in different horizontal planes.