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For the Inventor, By the Inventor

Bethlehem, PA, United States of America

Jonathan Almeria Noquil

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This inventor holds 52 USPTO granted patents and 12 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging. Top assignees: Texas Instruments Corporation, Ciclon Semiconductor Device Corp.. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jonathan Almeria Noquil. Retrieved from https://idiyas.com/inventor/jonathan-almeria-noquil

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 52 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 141(Granted Patents)

Forward Citations (Not Self Cited) = 116(Dec 10, 2025)


Location History:

  • Lapu Lapu, PH (2011 - 2013)
  • Bethlehem, PA (US) (2013 - 2023)
  • Plano, TX (US) (2021 - 2024)

Company Filing History:

goldMedal51 out of 29,888 
 
Texas Instruments Corporation
 patents
silverMedal1 out of 9 
 
Ciclon Semiconductor Device Corp.
 patents

Years Active: 2011-2026

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Areas of Expertise:
Flip-Chip Packaging
Power Converters
Multi-Die Modules
Silicon Packages
High I/O Density
Embedded Systems
Conductive Plates
Photo-Sensitive Silicon
Thermal Management
Solder Standoff
Ultra-Thin Transistors
Integrated Circuits
52 patents (USPTO):Explore Patents
1. 12575025 - Stress relief structure for flip-chip packaged devices (2026-03-10),
2. 12406915 - Plated metal layer in power packages (2025-09-02),
3. 12243809 - Packaged electronic device with film isolated power stack (2025-03-04),
4. 12176274 - Multi-die package with multiple heat channels (2024-12-24),
5. 12148556 - Integrated magnetic assembly (2024-11-19),
6. 12015019 - Stacked die multichip module package (2024-06-18),
7. 11930590 - Stress relief for flip-chip packaged devices (2024-03-12),
8. 11908780 - Semiconductor package with solder standoff (2024-02-20),
9. 11817375 - High I/O density flip-chip QFN (2023-11-14),
10. 11784114 - Plated metal layer in power packages (2023-10-10),
11. 11658130 - Conductive plate stress reduction feature (2023-05-23),
12. 11640932 - Packaged electronic device with film isolated power stack (2023-05-02),
13. 11177246 - Photo-sensitive silicon package embedding self-powered electronic system (2021-11-16),
14. 11177197 - Semiconductor package with solder standoff (2021-11-16),
15. 11081472 - Stacked die multichip module package (2021-08-03),

Title: Innovative Contributions of Jonathan Almeria Noquil

Introduction

Jonathan Almeria Noquil, based in Bethlehem, PA, is a prolific inventor with an impressive portfolio of 49 patents. His work in semiconductor technology has paved the way for innovative solutions that address the increasing complexity of electronic devices. Noquil’s patents reflect a deep understanding of thermal management and multilevel packaging systems, vital for modern electronics.

Latest Patents

Two of Noquil's latest patents exemplify his contributions to the field:

1. **Multi-die Package with Multiple Heat Channels** - This semiconductor package features a first die thermally coupled to a first thermally conductive device, with an exterior-facing surface for efficient heat dissipation. It also includes a second die positioned in a different horizontal plane, enhancing thermal management across the device.

2. **Integrated Magnetic Assembly** - This patent outlines an electronic device with a multilevel package substrate consisting of multiple levels with patterned conductive and molded dielectric features. Each level contains intricate windings crucial for the device's functionality, demonstrating Noquil's innovative approach to electronic packaging.

Career Highlights

Throughout his career, Jonathan Noquil has made significant strides in the semiconductor industry. He has worked at notable companies, including Texas Instruments Corporation and Ciclon Semiconductor Device Corporation, where he has honed his skills and contributed to groundbreaking technologies.

Collaborations

During his journey, Noquil has collaborated with talented coworkers, including Osvaldo Jorge Lopez and Juan Alejandro Herbsommer. These collaborations have enriched his work, fostering a dynamic environment for innovation and problem-solving.

Conclusion

Jonathan Almeria Noquil's contributions to the field of semiconductor technology showcase his commitment to innovation and excellence. With 49 patents and continued advancements in integrated systems, he is poised to influence the future of electronic devices significantly. His work exemplifies how inventors can transform complex challenges into practical solutions, setting the standard for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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