The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Apr. 25, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Tianyi Luo, Allen, TX (US);

Jonathan Almeria Noquil, Plano, TX (US);

Osvaldo Jorge Lopez, Annandale, NJ (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49537 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/49586 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/074 (2013.01); H01L 25/50 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.


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