The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Nov. 28, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Osvaldo Jorge Lopez, Annandale, NJ (US);

Jonathan Almeria Noquil, Bethlehem, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/31 (2006.01); H02M 3/155 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/563 (2013.01); H01L 23/3107 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49524 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 24/00 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H02M 3/155 (2013.01); H01L 24/48 (2013.01); H01L 2224/371 (2013.01); H01L 2224/3716 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49173 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/85 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1425 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1576 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01);
Abstract

Disclosed embodiments relate to a semiconductor device. A semiconductor device is fabricated by attachment of a first chip to a first surface of a pad of a leadframe. Each of one or more terminals of the first chip is connected to a respective lead of the leadframe. The first chip and the first surface of the pad are then encapsulated in a packaging material, while leaving an opposite second surface of the pad exposed. A second chip is attached to a recessed portion of the second surface of the pad so that at least one terminal of the second chip is substantially coplanar with an un-recessed portion of the second surface. In one embodiment, a third chip is also attached to the recessed portion of the second surface so that at least one terminal of the third chip is substantially coplanar with the un-recessed portion of the second surface.


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