Yuki, Japan

Nozomu Takano

This inventor holds 25 USPTO granted patents and 11 published patent applications and 1 EPO patent, primarily in Printed Circuit Boards. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 1993-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nozomu Takano. Retrieved from https://idiyas.com/inventor/nozomu-takano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 64.0

 

Average Co-Inventor Count = 4.0

ph-index = 5

Forward Citations = 85(Granted Patents)


Location History:

  • Shimodate, JP (1993 - 1995)
  • Yuki, JP (2001 - 2006)
  • Ibaraki-ken, JP (2004 - 2007)
  • Ibaraki, JP (2007 - 2010)
  • Chikusei, JP (2011 - 2014)
  • Yuuki, JP (2001 - 2017)
  • Tsukuba, JP (2019)

Company Filing History:


Years Active: 1993-2019

Loading Chart...
Loading Chart...
Areas of Expertise:
Printed Circuit Boards
Thermosetting Resin
Prepreg
Metal-Clad Laminate
Insulation Material
Solder Joint Formation
Dielectric Characteristics
Epoxy Resin Composition
Multilayer Printed Wiring Board
Copper-Clad Laminate
Varnish
Laminated Plate
25 patents (USPTO):Explore Patents

Title: Nozomu Takano: Innovator in Electronic Materials

Introduction

Nozomu Takano, a prolific inventor based in Yuki, Japan, holds an impressive portfolio of 25 patents. His contributions primarily focus on advancements in electronic materials, particularly in the fields of prepreg technology and solder joint formation methods.

Latest Patents

Among his latest innovations, Takano has developed several notable patents, including prepreg materials composed of a fiber base impregnated with a specially formulated resin composition. The resin incorporates an acrylic base, emphasizing a specific ratio in its IR spectrum to enhance performance. His patents also cover innovations related to films with resin, metal foils with resin, and metal-clad laminates designed to provide excellent bending resistance while preventing ion migration, ensuring high insulating reliability for printed wiring boards. Additionally, he has created a reflow film containing thermoplastic resin and solder particles which drastically improves storage and handling properties while enabling selective solder bump formation on substrate electrodes.

Career Highlights

Takano is currently affiliated with Hitachi Chemical Company, Ltd., where he continues to push the boundaries of technology in electronic materials. Throughout his career, his innovations have significantly influenced the design and manufacturing of printed wiring boards, making them more reliable and efficient.

Collaborations

Takano has collaborated with notable colleagues such as Tomio Fukuda and Michitoshi Arata, contributing to various research initiatives and patent developments that have advanced the industry standards for electronic components.

Conclusion

Nozomu Takano's innovative spirit and dedication to improving electronic materials have made him a key player in the field. Through his extensive patent portfolio and collaborations, he continues to influence the evolution of technology within the electronics industry. His work exemplifies the critical role that inventors play in shaping the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…