The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Dec. 05, 2017
Hitachi Chemical Company, Ltd., Tokyo, JP;
Akiko Kawaguchi, Tsukuba, JP;
Nozomu Takano, Tsukuba, JP;
Yasuyuki Mizuno, Chikusei, JP;
Kazumasa Takeuchi, Chikusei, JP;
Shigeru Haeno, Ichihara, JP;
Yoshinori Nagai, Ichihara, JP;
Masato Fukui, Chikusei, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cmdue to nitrile groups (P) with respect to the peak height near 1730 cmdue to carbonyl groups (P) in the IR spectrum of the cured resin composition (P/P) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.