The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2004

Filed:

Dec. 23, 1997
Applicant:
Inventors:

Nozomu Takano, Yuki, JP;

Shigeo Sase, Shimodate, JP;

Tomio Fukuda, Shimodate, JP;

Michitoshi Arata, Shimodate, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 9/00 ; C08K 9/06 ; C08K 5/24 ;
U.S. Cl.
CPC ...
B32B 9/00 ; C08K 9/06 ; C08K 5/24 ;
Abstract

Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.


Find Patent Forward Citations

Takano, Nozomu. (2004). Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances (U.S. Patent No. 6696155). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6696155

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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