Tokyo, Japan

Tomio Fukuda

This inventor holds 21 USPTO granted patents and 4 EPO patents, primarily in Printed Wiring Boards. Top assignees: Hitachi Chemical Company, Ltd., Showa Denko Materials Co., Ltd., Fuji Photo Film Company, Limited. Active years: 1985-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomio Fukuda. Retrieved from https://idiyas.com/inventor/tomio-fukuda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 95.2

 

Average Co-Inventor Count = 4.2

ph-index = 5

Forward Citations = 103(Granted Patents)


Location History:

  • Shimodate, JP (1985 - 2004)
  • Ibaraki-ken, JP (2004)
  • Tokyo, JP (1999 - 2022)

Company Filing History:


Years Active: 1985-2022

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Areas of Expertise:
Thermosetting Resin
Prepreg
Multilayer Printed Wiring Board
Resin Composition
High Speed Communication
Epoxy Resin
Transmission Line Plate
Incombustible Resin
Metal-Clad Laminate
Photographic Processing
Polyamino-Bis-Maleimide
Glass Fiber Material
21 patents (USPTO):Explore Patents

Title: Innovations of Tomio Fukuda in Thermosetting Resin Compositions

Introduction

Tomio Fukuda, based in Tokyo, Japan, is a highly regarded inventor known for his significant contributions to the field of materials science. With an impressive portfolio of 21 patents, Fukuda has demonstrated expertise in developing innovative thermosetting resin compositions, which have wide-ranging applications in electronics and materials technology.

Latest Patents

Fukuda's latest patents include inventions that focus on a thermosetting resin composition designed to enhance dielectric properties in high-frequency applications. This composition boasts a low dielectric constant, low dielectric dissipation factor, high adhesion to conductors, excellent heat resistance, a high glass transition temperature, a low thermal expansion coefficient, and remarkable flame retardancy. The key components of this innovative resin composition include a polyphenylene ether derivative with N-substituted maleimide structures, alongside various thermosetting resins such as epoxy resins and cyanate resins, further reinforced by a phosphorus flame retardant.

Another notable patent involves a resin composition containing a maleimide compound alongside a catalyst selected from imidazole compounds, phosphorus compounds, azo compounds, and organic peroxides. This formulation is essential for producing multilayer printed wiring boards, which are crucial in modern electronics.

Career Highlights

Tomio Fukuda has had a distinguished career with significant roles in prominent companies. He has worked for Hitachi Chemical Company, Ltd. and Showa Denko Materials Co., Ltd., where he has been instrumental in driving research and innovation in resin technologies. His extensive experience in these organizations has allowed him to develop cutting-edge solutions that address the evolving needs of the electronics industry.

Collaborations

Throughout his career, Fukuda has collaborated with talented professionals in his field, including colleagues such as Nozomu Takano and Takao Tanigawa. These partnerships have fostered a collaborative environment that has enhanced creativity and led to the successful development of numerous patented technologies.

Conclusion

Tomio Fukuda's contributions to the world of innovations, particularly in thermosetting resin compositions, are commendable. His dedication to advancing material science and engineering solidifies his reputation as a leading inventor. As technology continues to evolve, Fukuda's innovative work will undoubtedly remain influential in shaping the future of electronic materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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