The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Jul. 20, 2016
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Takao Tanigawa, Tokyo, JP;

Tetsurou Irino, Tokyo, JP;

Yuusuke Kondou, Tokyo, JP;

Etsuo Mizushima, Tokyo, JP;

Tomio Fukuda, Tokyo, JP;

Yuki Nagai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 1/02 (2006.01); H01B 7/08 (2006.01); H01L 23/12 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H01B 11/00 (2006.01); C08G 65/333 (2006.01); C08G 73/12 (2006.01); C08J 5/24 (2006.01); C08L 79/08 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/082 (2013.01); C08G 65/33396 (2013.01); C08G 73/121 (2013.01); C08J 5/24 (2013.01); C08L 79/08 (2013.01); H01B 7/08 (2013.01); H01B 11/00 (2013.01); H01L 23/12 (2013.01); H01P 11/003 (2013.01); H05K 1/0248 (2013.01); H05K 1/036 (2013.01); H05K 1/0366 (2013.01); H05K 3/4688 (2013.01); C08J 2379/08 (2013.01); C08J 2471/12 (2013.01); H05K 1/0346 (2013.01); H05K 2201/0191 (2013.01);
Abstract

Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.


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