Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Fuji Photo Film Company, Limited

Resonac Corporation

Tomio Fukuda

Nozomu Takano

Takao Tanigawa

Yuki Nagai

Michitoshi Arata

Hikari Murai

Shigeo Sase

Yasuyuki Mizuno

Yuusuke Kondou

Etsuo Mizushima

Yasuo Miyadera

Atsushi Fujioka

Masato Miyatake

Tetsurou Irino

Tetsuroh Irino

Minoru Kakitani

Eiji Yamada

Yuichi Shimayama

Kenichi Tomioka

Tomokazu Shimada

Kazutoshi Danjoubara

Masahisa Ose

Takeo Komazaki

Yasuo Kuramitsu

Shunsuke Tonouchi

Provided are a thermosetting resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the thermosetting resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a phosphorus flame retardant: wherein Reach independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.

Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board

The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a styrenic thermoplastic elastomer: 

Resin composition, prepreg, laminate and multilayer printed wiring board

Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.

Multilayer transmission line plate

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module

Provided is a multilayered transmission line plate including a pair of ground layers, a differential wiring disposed between a one-sided ground layer of the pair of ground layers and the other ground layer, an insulating layer (X) disposed between the differential wiring and the one-sided ground layer, and an insulating layer (Y) disposed between the differential wiring and the other ground layer, wherein the insulating layer (X) has a layer containing a resin and not containing a glass cloth; the insulating layer (X) or the insulating layer (Y) has a layer containing a glass cloth and a resin; and the thickness of the insulating layer (X) is equal to or less than the thickness of the insulating layer (Y).

A polyphenylene ether derivative having at least one N-substituted maleimide group represented by the following general formula (I) in a molecule, and a heat curable resin composition, a prepreg, a metal-clad laminate, and a multilayer printed wiring board, each of which uses the polyphenylene ether derivative: wherein Reach independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, Reach independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, Arepresents a residual group represented by a specific general formula, m is an integer of 1 or more as the number of the structural unit, and x and y each is an integer of 1 to 4.

Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same

An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.

Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board

Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.

Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances

Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances

Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards

This invention relates to a prepreg which comprises a substrate and a resin composition containing a resin, an inorganic filler in an amount of 25% by volume based on the total volume of a solid component of the resin composition and a silicone polymer, which resin composition being impregnated into the substrate, and to a metal-clad-laminated board which comprises at least one metal foil being laminated on both surfaces or one surface of the prepreg mentioned above, or a laminated board of the prepregs under heating and pressure.

Prepreg, metal-clad laminate, and printed circuit board obtained from these

An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.

Growing community of inventors

Tokyo, Japan

Tomio Fukuda