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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10876000 B1

PDFFull Text
Date of Patent:
Dec. 29, 2020

Filed:

May. 30, 2017

Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Shunsuke Tonouchi, Tokyo, JP;

Tomokazu Shimada, Tokyo, JP;

Kazutoshi Danjoubara, Tokyo, JP;

Tomio Fukuda, Tokyo, JP;

Minoru Kakitani, Tokyo, JP;

Assignee:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Richard A Huhn

Int. Cl.
CPC ...
C08G 73/02 (2006.01); C08G 73/10 (2006.01); C08L 79/08 (2006.01); C08L 25/08 (2006.01); C08L 35/06 (2006.01); C08L 79/02 (2006.01); C08J 5/24 (2006.01); C08G 73/00 (2006.01); C08L 15/00 (2006.01); H05K 1/03 (2006.01); B32B 15/088 (2006.01); B32B 15/08 (2006.01); B32B 5/28 (2006.01); C08L 79/00 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
C08L 79/02 (2013.01); B32B 5/02 (2013.01); B32B 5/28 (2013.01); B32B 15/08 (2013.01); B32B 15/088 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 73/00 (2013.01); C08G 73/0246 (2013.01); C08J 5/24 (2013.01); C08L 15/00 (2013.01); C08L 35/06 (2013.01); C08L 79/00 (2013.01); H05K 1/03 (2013.01); H05K 1/0373 (2013.01); B32B 2260/046 (2013.01); C08G 73/028 (2013.01); C08G 73/0273 (2013.01); C08G 73/10 (2013.01); C08J 2379/02 (2013.01); C08J 2409/06 (2013.01); C08J 2425/08 (2013.01); C08L 25/08 (2013.01); C08L 79/08 (2013.01);
Abstract

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Find Patent Forward Citations

Tonouchi, Shunsuke. (2020). Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module (U.S. Patent No. 10876000). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10876000

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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