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For the Inventor, By the Inventor

Shimodate, Japan

Michitoshi Arata

This inventor holds 10 USPTO granted patents and 2 published patent applications and 2 EPO patents. Top assignees: Hitachi Chemical Company, Ltd., Resonac Corporation. Active years: 2001-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michitoshi Arata. Retrieved from https://idiyas.com/inventor/michitoshi-arata

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 80.0

 

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 50(Granted Patents)


Company Filing History:

goldMedal9 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
silverMedal1 out of 402 
 
Resonac Corporation
 patents

Years Active: 2001-2026

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10 patents (USPTO):Explore Patents
1. 12760143 - Resin composition for molding and electronic component device (2026-10-13),
2. 7208539 - Thermosetting resin composition, and prepreg and laminated board using the same (2007-04-24),
3. 6696155 - Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances (2004-02-24),
4. 6692792 - Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances (2004-02-17),
5. 6572968 - Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards (2003-06-03),
6. 6558797 - Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same (2003-05-06),
7. 6462147 - Epoxy resin compositions for printed circuit board and printed circuit board using the same (2002-10-08),
8. 6329474 - Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole (2001-12-11),
9. 6214468 - Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same (2001-04-10),
10. 6180250 - Epoxy composition for printed circuit boards (2001-01-30),

I specialize in innovations, inventions, inventors, patent attorneys, assignees and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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