The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2001
Filed:
Apr. 03, 2000
Applicant:
Inventors:
Michitoshi Arata, Shimodate, JP;
Shigeo Sase, Shimodate, JP;
Nozomu Takano, Yuki, JP;
Tomio Fukuda, Shimodate, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E32B 2/704 ; C08L 6/110 ; C08L 6/112 ; C08L 6/304 ; C09J / ;
U.S. Cl.
CPC ...
E32B 2/704 ; C08L 6/110 ; C08L 6/112 ; C08L 6/304 ; C09J / ;
Abstract
An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formaldehyde, (c) a flame retardant, and (d) a curing accelerator, and a laminate for printed wiring boards which has a low hygroscopicity, a high heat resistance, good high-temperature characteristics, a high resistance against electrolytic corrosion, a high resistance against color change due to heating, and a high Tg.