The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Dec. 10, 2021
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Yuta Sukegawa, Tokyo, JP;
Arisa Yamauchi, Tokyo, JP;
Mika Tanaka, Tokyo, JP;
Tomoki Hirai, Tokyo, JP;
Yuji Noguchi, Tokyo, JP;
Yusuke Kondo, Tokyo, JP;
Michitoshi Arata, Tokyo, JP;
Masashi Yamaura, Tokyo, JP;
Ayumi Nakayama, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/38 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08K 3/22 (2006.01); C08K 3/24 (2006.01); C08K 3/36 (2006.01); C08L 63/00 (2006.01); C08L 101/00 (2006.01); C09K 3/10 (2006.01); H01Q 1/40 (2006.01); H10W 74/47 (2026.01);
U.S. Cl.
CPC ...
C08G 59/38 (2013.01); C08G 59/40 (2013.01); C08G 59/42 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C08K 3/22 (2013.01); C08K 3/24 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); C08L 101/00 (2013.01); C09K 3/10 (2013.01); H10W 74/473 (2026.01); C08K 2003/2227 (2013.01); C08K 2003/2237 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01); C08K 2201/014 (2013.01); C09K 2200/0239 (2013.01); C09K 2200/0647 (2013.01); H01Q 1/40 (2013.01);
Abstract
A resin composition for molding and an electronic component device are provided. The resin composition for molding includes: a curable resin; and an inorganic filler including a calcium titanate particle.
Sukegawa, Yuta. (2026). Resin composition for molding and electronic component device (U.S. Patent No. 12760143). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12760143
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile