Mika Tanaka

Title: Innovations by Mika Tanaka

Introduction

Mika Tanaka is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of resin compositions for electronic devices. His innovative work has led to the creation of a patented technology that enhances the efficiency of substrate conveyance in electronic manufacturing.

Latest Patents

Mika Tanaka holds a patent for a "Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic device." This resin composition is designed for the temporary fixing of a support for substrate conveyance to an organic substrate. The composition includes a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin is formed into a film and subjected to specific heating conditions, it achieves an elastic modulus of 350 to 550 MPa at 25° C. This innovation is crucial for improving the reliability and performance of electronic devices.

Career Highlights

Throughout his career, Mika Tanaka has focused on advancing materials used in electronic applications. His research and development efforts have positioned him as a key figure in the industry. With a patent portfolio that includes innovative solutions, he continues to influence the field of electronic device manufacturing.

Collaborations

Mika has collaborated with several talented individuals in his field, including Shogo Sobue and Shinji Irizawa. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Mika Tanaka's contributions to the field of materials science, particularly through his patented resin composition, demonstrate his commitment to innovation in electronic device manufacturing. His work not only enhances the efficiency of production processes but also sets a foundation for future advancements in the industry.