The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Oct. 31, 2019
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 7/35 (2018.01); C09J 5/06 (2006.01); C09J 7/25 (2018.01); C09J 11/08 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); C09J 5/06 (2013.01); C09J 7/25 (2018.01); C09J 11/08 (2013.01); H01L 21/568 (2013.01); H01L 21/6836 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08); C09J 2301/502 (2020.08); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); C09J 2479/086 (2013.01); C09J 2483/00 (2013.01);
Abstract
A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.