The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Oct. 31, 2019
Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Shogo Sobue, Tokyo, JP;

Shinji Irizawa, Tokyo, JP;

Mika Tanaka, Tokyo, JP;

Saeko Ogawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); B32B 7/10 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); C09J 7/22 (2018.01); C09J 7/38 (2018.01); C09J 11/08 (2006.01); C09J 133/06 (2006.01); C09J 163/00 (2006.01); H10P 72/70 (2026.01); H10W 72/00 (2026.01); H10W 74/01 (2026.01); H10W 74/47 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); H10P 72/70 (2026.01); B32B 7/10 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/30 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 37/12 (2013.01); B32B 2333/04 (2013.01); B32B 2367/00 (2013.01); B32B 2377/00 (2013.01); B32B 2379/00 (2013.01); B32B 2405/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/14 (2013.01); C08J 2323/12 (2013.01); C08J 2367/03 (2013.01); C08J 2377/02 (2013.01); C08J 2379/08 (2013.01); C08J 2433/06 (2013.01); C08J 2463/04 (2013.01); C09J 7/22 (2018.01); C09J 7/38 (2018.01); C09J 7/385 (2018.01); C09J 11/08 (2013.01); C09J 133/06 (2013.01); C09J 163/00 (2013.01); C09J 2203/326 (2013.01); C09J 2203/37 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2423/106 (2013.01); C09J 2467/006 (2013.01); C09J 2477/006 (2013.01); C09J 2479/086 (2013.01); H10P 72/74 (2026.01); H10P 72/7402 (2026.01); H10W 72/07207 (2026.01); H10W 74/019 (2026.01); H10W 74/473 (2026.01); H10W 90/724 (2026.01);
Abstract

A method for producing an electronic device includes a first step of pasting a support to an organic substrate having a thickness of 1000 μm or less, with a temporary fixing material interposed therebetween, to obtain a laminated body; a second step of heating the temporary fixing material of the laminated body; a third step of mounting a semiconductor chip on the organic substrate of the laminated body that has been subjected to the second step; a fourth step of sealing the semiconductor chip mounted on the organic substrate with a sealing material; and a fifth step of peeling the support and the temporary fixing material from the organic substrate of the laminated body that has been subjected to the fourth step.


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