The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
May. 19, 2006
Kazumasa Takeuchi, Chikusei, JP;
Nozomu Takano, Chikusei, JP;
Masaki Yamaguchi, Chikusei, JP;
Makoto Yanagida, Chikusei, JP;
Kazumasa Takeuchi, Chikusei, JP;
Nozomu Takano, Chikusei, JP;
Masaki Yamaguchi, Chikusei, JP;
Makoto Yanagida, Chikusei, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board () according to a preferred embodiment of the invention has a construction with a substrate (), a conductor () formed in a flexible region () and conductors () formed in non-flexible regions (). The conductor () formed in the flexible region () has a total thickness of 1-30 μm, and the conductors () formed in the non-flexible regions () have a total thickness of 30-150 μm.