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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9656353 B1

PDFFull Text
Date of Patent:
May. 23, 2017

Filed:

Oct. 26, 2012

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Kazuhiro Miyauchi, Tsukuba, JP;

Naoya Suzuki, Tsukuba, JP;

Nozomu Takano, Yuuki, JP;

Yukihiko Yamashita, Tsukuba, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Christine Enad

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); B23K 35/362 (2006.01); B23K 35/26 (2006.01); C22C 12/00 (2006.01); C22C 13/00 (2006.01); C22C 28/00 (2006.01); B23K 35/02 (2006.01); H01L 21/48 (2006.01); H01L 23/488 (2006.01); H01L 21/56 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); B23K 1/06 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 1/012 (2006.01); B23K 1/20 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/362 (2013.01); B23K 1/0016 (2013.01); B23K 1/012 (2013.01); B23K 1/06 (2013.01); B23K 1/203 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3613 (2013.01); C22C 12/00 (2013.01); C22C 13/00 (2013.01); C22C 28/00 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/488 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H05K 3/3478 (2013.01); B23K 2201/40 (2013.01); B23K 2201/42 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/11005 (2013.01); H01L 2224/11436 (2013.01); H01L 2224/11522 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/81101 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/8391 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83886 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10977 (2013.01);
Abstract

The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

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