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Kazuhiro Miyauchi

USPTO Granted Patents = 4 (Patent Applications = 1)

EPO Patents = 1

Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 6(Granted Patents)

Location History:

Ibaraki-ken, JP (2004)
Ibaraki, JP (2007 - 2010)
Tsukuba, JP (2017)

Company Filing History:

Hitachi Chemical Company, Ltd.

Years Active: 2004-2017

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4 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9656353 - Reflow film, solder bump formation method, solder joint formation method, and semiconductor device (2017-05-23),

2. 7736749 - Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board (2010-06-15),

3. 7166361 - Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board (2007-01-23),

4. 6787614 - Thermosetting resin composition and process for producing the same (2004-09-07),

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