Hitachi Chemical Company, Ltd.

Kazuhiro Miyauchi

Nozomu Takano

Hideo Baba

Yukihiko Yamashita

Naoya Suzuki

The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I):R'(H)SiX&#x2003;&#x2003;(I)(wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or &#x2014;OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R&#x2032; is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); 'k' is 1 or 2; 'm' is 0 or 1; and &#x201c;m+k&#x201d; is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.

Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board

Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board

There is here disclosed a thermosetting resin composition containing, as essential components, (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer having a bifunctional siloxane unit represented by the formula R SiO (wherein R is the same or a different organic group) in the molecule.

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Ibaraki, Japan

Kazuhiro Miyauchi