The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Oct. 31, 2003
Shinji Tsuchikawa, Ibaraki-ken, JP;
Kazuhito Kobayashi, Yuki, JP;
Yasuyuki Mizuno, Shimodate, JP;
Daisuke Fujimoto, Shimodate, JP;
Nozomu Takano, Yuki, JP;
Shinji Tsuchikawa, Ibaraki-ken, JP;
Kazuhito Kobayashi, Yuki, JP;
Yasuyuki Mizuno, Shimodate, JP;
Daisuke Fujimoto, Shimodate, JP;
Nozomu Takano, Yuki, JP;
Hitachi Chemical Co., LTD, Tokyo, JP;
Abstract
A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein Rrepresents hydrogen, a halogen, or a C–Chydrocarbon group; Rrepresents a halogen or a C–Chydrocarbon group; x istoand each of m and n is a natural number; and () a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.