Hitachi Chemical Company, Ltd.

Nozomu Takano

Tomio Fukuda

Michitoshi Arata

Kazuhito Kobayashi

Shigeo Sase

Yasuyuki Mizuno

Daisuke Fujimoto

Kazuhiro Miyauchi

Kazumasa Takeuchi

Katsuji Shibata

Hideo Baba

Masami Arai

Ikuo Hoshi

Masato Miyatake

Shinji Tsuchikawa

Kenichi Tomioka

Hikari Murai

Atsushi Takahashi

Naoyuki Urasaki

Akishi Nakaso

Katsuyuki Masuda

Kazunori Yamamoto

Shigeharu Arike

Yasushi Kumashiro

Koji Morita

Yukihiko Yamashita

Kazuhisa Otsuka

Yoshiyuki Takeda

Masaki Yamaguchi

Makoto Yanagida

Naoya Suzuki

Takahiro Tanabe

Masashi Tanaka

Kazuhito Obata

Yoshitsugu Matsuura

Masaki Kamiya

Masahisa Ose

Akiko Kawaguchi

Shigeru Haeno

Yoshinori Nagai

Yuuji Ooyama

Masato Fukui

The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cmdue to nitrile groups (P) with respect to the peak height near 1730 cmdue to carbonyl groups (P) in the IR spectrum of the cured resin composition (P/P) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.

Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board () according to a preferred embodiment of the invention has a construction with a substrate (), a conductor () formed in a flexible region () and conductors () formed in non-flexible regions (). The conductor () formed in the flexible region () has a total thickness of 1-30 &#x3bc;m, and the conductors () formed in the non-flexible regions () have a total thickness of 30-150 &#x3bc;m.

Printed wiring board

It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite () of the invention that comprises a fiber sheet () impregnated with a resin composition (), wherein the 20&#xb0; C. storage elastic modulus of the cured resin composition () is 100-2000 MPa. The composite () optionally contains perforations ().

Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof

A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90&#xb0;, cracks do not occur in the base material.

Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board

A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I):R'(H)SiX&#x2003;&#x2003;(I)(wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or &#x2014;OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R&#x2032; is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); 'k' is 1 or 2; 'm' is 0 or 1; and &#x201c;m+k&#x201d; is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.

Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board

Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board

A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiOand tetra-functional siloxane unit represented by SiO, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).

Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate

A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein Rrepresents hydrogen, a halogen, or a C&#x2013;Chydrocarbon group; Rrepresents a halogen or a C&#x2013;Chydrocarbon group; x istoand each of m and n is a natural number; and () a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

Thermosetting resin composition and use thereof

There is here disclosed a thermosetting resin composition containing, as essential components, (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer having a bifunctional siloxane unit represented by the formula R SiO (wherein R is the same or a different organic group) in the molecule.

Thermosetting resin composition and process for producing the same

An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.

Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board

Printed wiring boards improved in the drilling processability and insulation properties are produced either by treating the surfaces of base materials or inorganic fillers with silicone oligomers having specified structures, particularly, a three-dimensionally crosslinked silicone oligomer, or by using resin varnish prepared by compounding such a silicone oligomer with a resin varnish for impregnation of the base materials, or by dipping the inorganic fillers in a solution of such a silicone oligomer for surface treatment and then directly compounding resin materials with the solution.

Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances

Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances

Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards

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Yuki, Japan

Nozomu Takano