Noriaki Mukai

Title: **Noriaki Mukai: Innovator in Printed Substrate Manufacturing**

Introduction

Noriaki Mukai is a distinguished inventor based in Toride, Japan, known for his significant contributions to the field of printed substrate manufacturing. With a portfolio of nine patents, Mukai has pioneered several innovative techniques that enhance the efficiency and reliability of semiconductor chip assembly.

Latest Patents

Among his latest innovations is the **Printed substrate manufacturing equipment and manufacturing method**. This invention outlines a process where solder bumps are formed on multiple electrode parts of a printed substrate, to which a semiconductor chip is subsequently loaded. A notable feature in this patent is the utilization of a thermoplastic film as an underfill, covering the surface where the solder bumps are located. The film is precisely shaped to allow for the seamless application of heat and pressure during the reflow process, facilitating the fusion of the solder bumps.

Another significant patent is the **Micro-bump forming apparatus**. This apparatus incorporates a series of mechanisms designed to streamline the manufacturing process of micro-bumps. Features include a film attachment mechanism, exposure and developing tools for creating openings over electrodes, solder ball loading capabilities, flux printing, and a reflow section. This innovative device not only simplifies the assembly process but also ensures high precision and reliability in solder bump formation.

Career Highlights

Throughout his career, Noriaki Mukai has contributed his expertise to prominent research and engineering firms. His notable positions at Hitachi Techno Engineering Co., Ltd. and Hitachi Plant Technologies, Ltd. laid the foundation for his pioneering advancements in printed substrate technology. His work at these organizations has significantly influenced the development and application of modern semiconductor technologies.

Collaborations

Mukai has collaborated with esteemed colleagues, including Makoto Homma and Isao Abe. Their combined efforts have fostered innovative project developments and furthered advancements in their respective fields, solidifying their contributions to semiconductor manufacturing technologies.

Conclusion

Noriaki Mukai stands out as a leading inventor in the realm of printed substrate manufacturing. His patents not only demonstrate his innovative spirit but also reflect his dedication to enhancing technology in semiconductor assembly processes. As the industry evolves, Mukai's contributions will undoubtedly continue to play a crucial role in shaping the future of manufacturing technologies.