The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
May. 19, 2011
Noriaki Mukai, Toride, JP;
Isao Abe, Katori, JP;
Noriaki Mukai, Toride, JP;
Isao Abe, Katori, JP;
Hitachi Plant Technologies, Ltd., Tokyo, JP;
Abstract
A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.