The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Aug. 19, 2009
Makoto Honma, Tokyo, JP;
Noriaki Mukai, Tokyo, JP;
Shinichiro Kawabe, Tokyo, JP;
Akio Igarashi, Tokyo, JP;
Naoaki Hashimoto, Tokyo, JP;
Makoto Honma, Tokyo, JP;
Noriaki Mukai, Tokyo, JP;
Shinichiro Kawabe, Tokyo, JP;
Akio Igarashi, Tokyo, JP;
Naoaki Hashimoto, Tokyo, JP;
Hitachi Plant Technologies, Ltd., Tokyo, JP;
Abstract
Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.