Makoto Honma

Title: Innovative Mind: The Patents of Makoto Honma

Introduction: Makoto Honma, a prominent inventor based in Tokyo, Japan, has made significant contributions to the field of semiconductor manufacturing. With a total of five patents to his name, his innovations have pushed the boundaries of technology and precision in electronics.

Latest Patents: Among his latest inventions is the Solder Ball Printing Apparatus. This ingenious device ensures solder balls are uniformly dispersed on a mask surface, allowing for greater accuracy in the printing process. The apparatus features a solder ball shaking and discharging unit, which includes a solder ball reception unit, a convex wire member, and mechanisms for sweeping and collecting solder balls. By utilizing semi-spiral wire rods in the printing head, the solder balls are effectively moderated and dispersed into the mask's opening, accommodating the recent trend of miniaturized solder bumps on semiconductor chips.

Career Highlights: Makoto Honma's career includes vital roles in notable companies such as Hitachi, Ltd. and Hitachi Plant Technologies, Ltd. His experience within these respected organizations has allowed him to hone his skills and contribute to groundbreaking advancements in technology and manufacturing processes.

Collaborations: Throughout his career, Makoto has collaborated with esteemed colleagues like Sotozi Hiramoto and Seiji Hata. Together, they have worked on pushing the envelope in semiconductor technology, aiming for solutions that enhance efficiency and precision.

Conclusion: Makoto Honma’s work exemplifies the spirit of innovation. His patents, particularly the solder ball printing apparatus, reflect a deep understanding of the complexities involved in semiconductor manufacturing. As the industry continues to evolve, inventors like Honma remain at the forefront, ensuring that technological advancement keeps pace with the demands of the future.