The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Apr. 08, 2010
Makoto Honma, Tokyo, JP;
Akio Igarashi, Tokyo, JP;
Naoaki Hashimoto, Tokyo, JP;
Noriaki Mukai, Tokyo, JP;
Makoto Honma, Tokyo, JP;
Akio Igarashi, Tokyo, JP;
Naoaki Hashimoto, Tokyo, JP;
Noriaki Mukai, Tokyo, JP;
Hitachi Plant Technologies, Ltd., Tokyo, JP;
Abstract
The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.