Hitachi Techno Engineering Co., Ltd.

Hitachi Plant Technologies, Ltd.

Hitachi, Ltd.

Noriaki Mukai

Haruo Mishina

Makoto Homma

Yukio Yamada

Akio Igarashi

Makoto Honma

Yushi Takahashi

Naoaki Hashimoto

Isao Abe

Toshihiko Takeda

Mitsuhiko Sato

Shinichiro Kawabe

Masaru Mitsumoto

Norio Murata

Tetuji Machita

Nobuyuki Azuma

Yasusuke Hayashi

Solder bumps are formed on a plurality of electrode parts of a printed substrate and a semiconductor chip is loaded on the printed substrate via the plurality of solder bumps. In this case, a thermoplastic film is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure are applied to fuse the solder bumps.

Printed substrate manufacturing equipment and manufacturing method

A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.

Micro-bump forming apparatus

The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.

Solder ball printing apparatus

Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.

A screen printing apparatus,has a roll paper vibrating device which vibrates roll paper in contact with the lower surface of a screen mask in a direction perpendicular to a moving direction of the roll paper while the roll paper is being moved in contact with the lower surface of the screen mask. Thereby, the roll paper in contact with the lower surface of the screen mask is moved in a waveform-shape pattern. Therefore, the cumulative contact area of the roll paper on the lower surface of the mask is increased, and it is possible to efficiently remove residue, such as paste attached onto the lower surface of the screen mask of the printing apparatus and paste attached inside pattern openings of the screen mask, to maintain a good printing performance.

Screen printing apparatus

A screen printer effects a printing by moving a squeegee in contact with a screen to force a printing paste through a printing pattern formed on the screen. The squeegee is held by a squeegee head. The squeegee head includes a support member for supporting the squeegee in such a manner as to move the squeegee upward and downward, and at least one moving member which swingably supports the support member and is movable together with the support member. When the squeegee is to be exchanged, only the support member is angularly movable relative to the moving member so as to provide a sufficient space above the screen to facilitate the exchange of the squeegee.

Screen printer

A method and apparatus for printing an electronic circuit on a board by screen printing. A board to be printed is transported from a supply/discharge station to a positioning station and then to a printing station and is returned to the supply/discharge station. At the positioning station spaced from the printing station, positioning of the board is effected by an image processor and an XY.theta. table. The board thus positioned is transported to the printing station while the board is kept in the positioned state. At the printing station, a screen printing is effected on the thus correctly positioned board.

Method and apparatus for screen printing

An apparatus for fixing electronic parts to a printed circuit board is disclosed which comprises a vapor generating tank or boiling and generating a thermal medium and a returning tank for receiving the thermal medium containing flux. The vapor generating tank and the returning tank are separated from each other. By utilizing the level difference between the vapor generating tank and the returning tank, the thermal medium is charged into a flux separator and discharged therefrom. Thus, the mixture of the flux into the thermal medium may be reduced and its maintenance work may readily be carried out, thereby reducing a running cost of the apparatus.

Apparatus for fixing electronic parts to printed circuit board

An apparatus for fitting electronic parts to a printed circuit board is disclosed which comprises a collector for collecting thermal medium adhered to a conveyor that is travelling out of a vapor tank. Thus, it is possible to prevent generation of poisonous gas and to enhance a safety aspect of the apparatus. Also, since it is possible to collect the thermal medium, the running cost may be reduced.

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Toride, Japan

Noriaki Mukai