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Hitachi Techno Engineering Co., Ltd.

USPTO Granted Patents = 41

Forward Citations = 651

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93 inventors (with patents filed for the assignee):

Haruo Mishina (19 out of 19 patents)

Shinya Yamama (6 out of 6 patents)

Akimi Miyashita (6 out of 7 patents)

4. Mutsumasa Fujii (6 out of 6 patents)

5. Noriaki Mukai (5 out of 9 patents)

6. Masato Itagaki (4 out of 13 patents)

7. Yukio Yamada (4 out of 6 patents)

8. Tomio Yoneda (4 out of 4 patents)

9. Shigeru Ishida (4 out of 4 patents)

10. Yushi Takahashi (3 out of 3 patents)

11. Makoto Homma (2 out of 12 patents)

12. Satoshi Yawata (2 out of 3 patents)

13. Kiyonori Kogawa (2 out of 6 patents)

14. Keizo Tsuchiya (2 out of 2 patents)

15. Masahumi Wada (2 out of 2 patents)

Core Competencies:

Vacuum Film Laminating

Screen Printing Apparatus

Reflow Soldering

Hot Press Technology

Electronic Component Detection

User-Motion-Response Equipment

Induction Motor Control

Multilayer Circuit Boards

Paste Application

Synchronous Position Correction

Thin Film Cutting

Grinder Technology

41 patents: Sort by Forward Citations

1. 6453963 - Vacuum film laminating apparatus (2002-09-24),

2. 6237484 - Screen printing apparatus (2001-05-29),

3. 6156090 - Air cleaner having vanes with a winglike cross-section between a shroud (2000-12-05),

4. 5932012 - Paste applicator having positioning means (1999-08-03),

5. 5910001 - Method for adjusting engaged clearance between rotors of screw (1999-06-08),

6. 5800314 - User-motion-response type exercise equipment (1998-09-01),

7. 5716207 - Heating furnace (1998-02-10),

8. 5614024 - Apparatus for applying paste (1997-03-25),

9. 5578159 - Hot press for producing multilayer circuit board (1996-11-26),

10. 5558015 - Hot press with pressure vessels to uniformly distribute pressure to the (1996-09-24),

11. 5555798 - Hot press for producing a multilayered substrate (1996-09-17),

12. 5496433 - Hot press for use in production of multilayered substrate (1996-03-05),

13. 5490084 - Method and apparatus for detecting bent leads in electronic components (1996-02-06),

14. 5467912 - Reflow soldering apparatus for soldering electronic parts to circuit (1995-11-21),

15. 5437727 - Apparatus for drawing paste pattern on substrate (1995-08-01),

Hitachi Techno Engineering Co., Ltd. is a global engineering company that offers a wide range of innovative solutions across various industries. With a commitment to technological excellence, Hitachi Techno Engineering provides high-quality products and services in areas like power systems, industrial machinery, information and telecommunication systems, and electronic systems. Through continuous research and development, they strive to contribute to the advancement of society and enhance the quality of life for people around the world.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

41 Patents

#794 in Tokyo

#1,898 in Japan

#16,216 in the World

Hitachi Techno Engineering Co., Ltd.

Forward Citations = 651

93 inventors:

Haruo Mishina (19 out of 19 patents)

Shinya Yamama (6 out of 6 patents)

Akimi Miyashita (6 out of 7 patents)

4. Mutsumasa Fujii (6 out of 6 patents)

5. Noriaki Mukai (5 out of 9 patents)

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