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Hitachi Techno Engineering Co., Ltd.

USPTO Granted Patents = 41

Forward Citations = 667

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93 inventors (with patents filed for the assignee):

Haruo Mishina (19 out of 19 patents)

Shinya Yamama (6 out of 6 patents)

Akimi Miyashita (6 out of 7 patents)

4. Mutsumasa Fujii (6 out of 6 patents)

5. Noriaki Mukai (5 out of 9 patents)

6. Masato Itagaki (4 out of 13 patents)

7. Yukio Yamada (4 out of 6 patents)

8. Tomio Yoneda (4 out of 4 patents)

9. Shigeru Ishida (4 out of 4 patents)

10. Yushi Takahashi (3 out of 3 patents)

11. Makoto Homma (2 out of 12 patents)

12. Satoshi Yawata (2 out of 3 patents)

13. Kiyonori Kogawa (2 out of 6 patents)

14. Keizo Tsuchiya (2 out of 2 patents)

15. Masahumi Wada (2 out of 2 patents)

Core Competencies:

Reflow Soldering

Screen Printing

Hot Press

Electronic Components

Circuit Board

Paste Applicator

Induction Motor

Synchronous Position Correction

Thin Film Cutting

High Vacuum

Grinder

Positioning Means

41 patents: Sort by Forward Citations

1. 6453963 - Vacuum film laminating apparatus (2002-09-24),

2. 6237484 - Screen printing apparatus (2001-05-29),

3. 6156090 - Air cleaner having vanes with a winglike cross-section between a shroud (2000-12-05),

4. 5932012 - Paste applicator having positioning means (1999-08-03),

5. 5910001 - Method for adjusting engaged clearance between rotors of screw (1999-06-08),

6. 5800314 - User-motion-response type exercise equipment (1998-09-01),

7. 5716207 - Heating furnace (1998-02-10),

8. 5614024 - Apparatus for applying paste (1997-03-25),

9. 5578159 - Hot press for producing multilayer circuit board (1996-11-26),

10. 5558015 - Hot press with pressure vessels to uniformly distribute pressure to the (1996-09-24),

11. 5555798 - Hot press for producing a multilayered substrate (1996-09-17),

12. 5496433 - Hot press for use in production of multilayered substrate (1996-03-05),

13. 5490084 - Method and apparatus for detecting bent leads in electronic components (1996-02-06),

14. 5467912 - Reflow soldering apparatus for soldering electronic parts to circuit (1995-11-21),

15. 5437727 - Apparatus for drawing paste pattern on substrate (1995-08-01),

Company Overview

Hitachi Techno Engineering Co., Ltd., based in Tokyo, specializes in advanced manufacturing technologies and equipment. The company focuses on vacuum film laminating, screen printing apparatus, and reflow soldering, catering to the needs of the electronics industry. Its expertise extends to hot press technology and electronic component detection, enhancing production efficiency and quality. Additionally, Hitachi Techno Engineering develops user-motion-response equipment and induction motor control systems, contributing to innovations in multilayer circuit board technology.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

41 Patents

#908 in Tokyo

#1,943 in Japan

#16,706 in the World

Hitachi Techno Engineering Co., Ltd.

Forward Citations = 667

93 inventors:

Haruo Mishina (19 out of 19 patents)

Shinya Yamama (6 out of 6 patents)

Akimi Miyashita (6 out of 7 patents)

4. Mutsumasa Fujii (6 out of 6 patents)

5. Noriaki Mukai (5 out of 9 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hitachi Techno Engineering Co., Ltd.. Retrieved from https://idiyas.com/company/hitachi-techno-engineering-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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