Noboru Okubo

Title: Noboru Okubo: Innovator in Semiconductor Technology

Introduction

Noboru Okubo is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His innovative work has led to advancements in manufacturing processes and device design.

Latest Patents

One of his latest patents is titled "Solder bump formation using wafer with ring." This invention involves forming at least one circuit element on a front side of a ringed substrate, which is mounted on a specialized chuck. The chuck features an inner raised portion to support the thinned substrate and a recessed ring to accommodate the outer ring of the substrate. This design allows for the formation of solder bumps that are electrically connected to the circuit elements. Another notable patent is "Semiconductor device and manufacturing method thereof." This patent describes a simplified manufacturing process for packaged semiconductor devices, which reduces costs, thickness, and size. The process includes bonding a supporter to the semiconductor substrate and forming a protection layer with an opening for a pad electrode.

Career Highlights

Noboru Okubo has worked with notable companies such as Sanyo Semiconductor Co., Ltd. and Sanyo Electric Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Throughout his career, Okubo has collaborated with talented individuals, including Takashi Noma and Hiroyuki Shinogi. These partnerships have fostered a creative environment that has led to groundbreaking advancements in the field.

Conclusion

Noboru Okubo's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry, paving the way for future innovations.