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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11264264 B1

PDFFull Text
Date of Patent:
Mar. 01, 2022

Filed:

Oct. 23, 2019

Solder bump formation using wafer with ring

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Takashi Noma, Ota, JP;

Noboru Okubo, Kumagaya, JP;

Yusheng Lin, Phoenix, AZ (US);

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorney:

Brake Hughes Bellermann LLP

Primary Examiner:

Kenneth Parker

Assistant Examiner:

Long H Le

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/30 (2006.01); H01L 21/687 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 29/861 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68735 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 29/7393 (2013.01); H01L 29/861 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/1147 (2013.01);
Abstract

At least one circuit element may be formed on a front side of a ringed substrate, and the ringed substrate may be mounted on a mounting chuck. The mounting chuck may have an inner raised portion configured to receive the thinned portion of the substrate thereon, and a recessed ring around a perimeter of the mounting chuck configured to receive the outer ring of the ringed substrate therein. At least one solder bump may be formed that is electrically connected to the at least one circuit element, while the ringed wafer is disposed on the mounting chuck.

Find Patent Forward Citations

Noma, Takashi. (2022). Solder bump formation using wafer with ring (U.S. Patent No. 11264264). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11264264

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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