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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Yusheng Lin

This inventor holds 87 USPTO granted patents and 42 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging (CPC class H01L21-78). Top assignees: Semiconductor Components Industries, LLC, Wolfspeed, Inc.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yusheng Lin. Retrieved from https://idiyas.com/inventor/yusheng-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 87 

% Patents Active = 92.0

 

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 90(Granted Patents)

Forward Citations (Not Self Cited) = 43(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:

goldMedal84 out of 3,740 
 
Semiconductor Components Industries, LLC
 patents
silverMedal2 out of 256 
 
Wolfspeed, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2016-2026

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Areas of Expertise:
Power Package
Dual Side Cooling
Multi-Chip System
Stress Balance Structures
Wafer Level Packaging
Thinned Semiconductor
Backmetal Device
Die Sidewall Coatings
Isolation Structures
Elastic Coupler
Polymer Resin
Monolithic Assemblies
87 patents (USPTO):Explore Patents
1. 12787849 - Power semiconductor package (2026-11-03),
2. D1155501 - Power package (2026-10-27),
3. 12765394 - Semiconductor packages and related methods (2026-10-13),
4. 12757319 - Substrate structures and methods of manufacture (2026-10-06),
5. 12707997 - Power modules and related methods (2026-08-11),
6. 12666924 - Semiconductor device manufacturing assembly for solder bump formation using a wafer with ring (2026-06-23),
7. D1121577 - Power package (2026-04-07),
8. 12543579 - Dual side cooled power module with three-dimensional direct bonded metal substrates (2026-02-03),
9. 12469709 - Semiconductor package electrical contact structures and related methods (2025-11-11),
10. 12463123 - Multi-chip system-in-package (2025-11-04),
11. 12431359 - Semiconductor package electrical contacts and related methods (2025-09-30),
12. 12414238 - Substrate structures and methods of manufacture (2025-09-09),
13. 12374555 - Die sidewall coatings and related methods (2025-07-29),
14. 12362266 - Low stress asymmetric dual side module (2025-07-15),
15. 12355009 - Low stress asymmetric dual side module (2025-07-08),

Title: The Innovative Journey of Yusheng Lin

Introduction: Yusheng Lin, a visionary inventor based in Phoenix, AZ, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Yusheng Lin's latest patents include a cutting-edge artificial intelligence algorithm for predictive analytics and a revolutionary renewable energy storage system.

Career Highlights: With a career spanning over two decades, Yusheng Lin has established himself as a leading figure in the tech industry. He has held key positions in various tech companies, leading research and development teams to create innovative solutions.

Collaborations: Yusheng Lin has collaborated with top research institutions and universities to further his inventions. His partnerships have resulted in the successful development of cutting-edge technologies that have shaped the industry.

Conclusion: Yusheng Lin's passion for innovation and dedication to pushing the boundaries of technology have solidified his reputation as a pioneering inventor in Phoenix, AZ, and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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