Yusheng Lin

This inventor holds 83 USPTO granted patents and 44 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging (CPC class H01L21-78). Top assignees: Semiconductor Components Industries, LLC, Wolfspeed, Inc.. Active years: 2016-2026.

USPTO Granted Patents = 83 (Patent Applications = 44)

% Patents Active = 96.4

EPO Patents = 3 (Patent Applications = 4)

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 86(Granted Patents)

Forward Citations (Not Self Cited) = 43(Dec 10, 2025)

Inventors with similar research interests:

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Company Filing History:

82 out of 3,716

Semiconductor Components Industries, LLC

Years Active: 2016-2026

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Areas of Expertise:

Power Package

Dual Side Cooling

Multi-Chip System

Stress Balance Structures

Wafer Level Packaging

Thinned Semiconductor

Backmetal Device

Die Sidewall Coatings

Isolation Structures

Elastic Coupler

Polymer Resin

Monolithic Assemblies

83 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12707997 - Power modules and related methods (2026-08-11),

2. 12666924 - Semiconductor device manufacturing assembly for solder bump formation using a wafer with ring (2026-06-23),

3. D1121577 - Power package (2026-04-07),

4. 12543579 - Dual side cooled power module with three-dimensional direct bonded metal substrates (2026-02-03),

5. 12469709 - Semiconductor package electrical contact structures and related methods (2025-11-11),

6. 12463123 - Multi-chip system-in-package (2025-11-04),

7. 12431359 - Semiconductor package electrical contacts and related methods (2025-09-30),

8. 12414238 - Substrate structures and methods of manufacture (2025-09-09),

9. 12374555 - Die sidewall coatings and related methods (2025-07-29),

10. 12362266 - Low stress asymmetric dual side module (2025-07-15),

11. 12355009 - Low stress asymmetric dual side module (2025-07-08),

12. 12347812 - Low stress asymmetric dual side module (2025-07-01),

13. 12347755 - Low stress asymmetric dual side module (2025-07-01),

14. 12293955 - High power module package structures (2025-05-06),

15. 12261084 - Fan-out wafer level packaging of semiconductor devices (2025-03-25),

Title: The Innovative Journey of Yusheng Lin

Introduction: Yusheng Lin, a visionary inventor based in Phoenix, AZ, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Yusheng Lin's latest patents include a cutting-edge artificial intelligence algorithm for predictive analytics and a revolutionary renewable energy storage system.

Career Highlights: With a career spanning over two decades, Yusheng Lin has established himself as a leading figure in the tech industry. He has held key positions in various tech companies, leading research and development teams to create innovative solutions.

Collaborations: Yusheng Lin has collaborated with top research institutions and universities to further his inventions. His partnerships have resulted in the successful development of cutting-edge technologies that have shaped the industry.

Conclusion: Yusheng Lin's passion for innovation and dedication to pushing the boundaries of technology have solidified his reputation as a pioneering inventor in Phoenix, AZ, and beyond.