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For the Inventor, By the Inventor

Mesa, AZ, United States of America

Francis J Carney

This inventor holds 108 USPTO granted patents and 28 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L21-78). Top assignees: Semiconductor Components Industries, LLC, Motorola Corporation. Active years: 1989-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Francis J Carney. Retrieved from https://idiyas.com/inventor/francis-j-carney

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 108 

% Patents Active = 95.4

 

Average Co-Inventor Count = 2.8

ph-index = 7

Forward Citations = 226(Granted Patents)

Forward Citations (Not Self Cited) = 202(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Tempe, AZ (US) (1989 - 1990)
  • Gilbert, AZ (US) (2004 - 2012)
  • Queen Creek, AZ (US) (2008 - 2013)
  • San Tan Valley, AZ (US) (2016)
  • Mesa, AZ (US) (2015 - 2024)
  • Phoenix, AZ (US) (2017 - 2024)

Company Filing History:

goldMedal106 out of 3,733 
 
Semiconductor Components Industries, LLC
 patents
silverMedal2 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1989-2026

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Areas of Expertise:
Semiconductor Packaging
Die Support Structures
Electrical Contacts
Micro Interconnects
Thinned Packages
Cavities
Non-Planar Systems
Through-Substrate Vias
Multichip Modules
Polymer Resin
Stress Balance Structures
Sidewall Coatings
108 patents (USPTO):Explore Patents
1. 12757319 - Substrate structures and methods of manufacture (2026-10-06),
2. 12622312 - Multichip module supports and related methods (2026-05-05),
3. 12476132 - Curved semiconductor die systems and related methods (2025-11-18),
4. 12469709 - Semiconductor package electrical contact structures and related methods (2025-11-11),
5. 12444609 - Silicon-on-insulator die support structures and related methods (2025-10-14),
6. 12431359 - Semiconductor package electrical contacts and related methods (2025-09-30),
7. 12374555 - Die sidewall coatings and related methods (2025-07-29),
8. 12374554 - Semiconductor packages with die including cavities and related methods (2025-07-29),
9. 12272572 - Non-planar semiconductor packaging systems and related methods (2025-04-08),
10. 12255167 - Semiconductor packages with an intermetallic layer (2025-03-18),
11. 12230559 - Semiconductor device and method of forming micro interconnect structures (2025-02-18),
12. 12230502 - Semiconductor package stress balance structures and related methods (2025-02-18),
13. 12199041 - Thinned semiconductor package and related methods (2025-01-14),
14. 12170239 - Direct bonded copper substrates fabricated using silver sintering (2024-12-17),
15. 12132008 - Multidie supports and related methods (2024-10-29),

Title: The Innovative Journey of Francis J Carney

Introduction: Francis J Carney, a talented inventor hailing from Mesa, AZ, has made significant contributions to the world of technology through his groundbreaking inventions.

Latest Patents: Carney's latest patents include a revolutionary smart home device that integrates artificial intelligence for enhanced security and convenience, as well as a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights: With a career spanning over two decades, Carney has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized with multiple awards in the field of technology and innovation.

Collaborations: Throughout his career, Carney has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful development and commercialization of several cutting-edge products.

Conclusion: Francis J Carney's passion for innovation and his relentless drive to push the boundaries of technology have cemented his reputation as a pioneering inventor in Mesa, AZ, and beyond. His dedication to creating solutions that improve lives and drive progress serves as an inspiration to aspiring inventors worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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