The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Nov. 30, 2023
Applicant:
Wolfspeed, Inc., Durham, NC (US);
Inventors:
Geza Dezsi, Durham, NC (US);
Yusheng Lin, Phoenix, AZ (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 74/10 (2026.01); H10W 42/80 (2026.01); H10W 70/40 (2026.01);
U.S. Cl.
CPC ...
H10W 74/111 (2026.01); H10W 42/80 (2026.01); H10W 70/481 (2026.01);
Abstract
Power semiconductor packages are provided. In one example, the power semiconductor package includes one or more semiconductor die having a wide bandgap semiconductor material, a housing, and one or more electrical leads extending from the housing. The power semiconductor package further includes a creepage cutout. In one example, the power semiconductor package further includes a creepage feature.
Quick Actions:
Dezsi, Geza. (2026). Power semiconductor package (U.S. Patent No. 12787849). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787849
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile