The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Dec. 15, 2006
Takashi Noma, Gunma, JP;
Kazuo Okada, Gunma, JP;
Shinzo Ishibe, Gunma, JP;
Katsuhiko Kitagawa, Gunma, JP;
Yuichi Morita, Gunma, JP;
Shigeki Otsuka, Chiba, JP;
Hiroshi Yamada, Gunma, JP;
Noboru Okubo, Saitama, JP;
Hiroyuki Shinogi, Gunma, JP;
Mitsuru Okigawa, Aichi, JP;
Takashi Noma, Gunma, JP;
Kazuo Okada, Gunma, JP;
Shinzo Ishibe, Gunma, JP;
Katsuhiko Kitagawa, Gunma, JP;
Yuichi Morita, Gunma, JP;
Shigeki Otsuka, Chiba, JP;
Hiroshi Yamada, Gunma, JP;
Noboru Okubo, Saitama, JP;
Hiroyuki Shinogi, Gunma, JP;
Mitsuru Okigawa, Aichi, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
This invention provides a semiconductor device that solves a problem that a pattern of a wiring formed on a back surface of a semiconductor substrate is reflected on an output image. A light receiving element (e.g. a CCD, an infrared ray sensor, a CMOS sensor, or an illumination sensor) is formed on a front surface of a semiconductor substrate, and a plurality of ball-shaped conductive terminals is disposed on a back surface of the semiconductor substrate. Each of the conductive terminals is electrically connected to a pad electrode on the front surface of the semiconductor substrate through a wiring layer. The wiring layer and the conductive terminal are formed on the back surface of the semiconductor substrate except in a region overlapping the light receiving element in a vertical direction, and are not disposed in a region overlapping the light receiving element.